Wave & Selective Soldering

S-WS450 Lead-Free Dual-Wave Soldering Machine

PC-controlled lead-free dual-wave soldering with nitrogen option — tuned for 1-year ROI

  • Independent chip wave + laminar main wave for shadow-free joints
  • PC recipe control with full data logging for traceability
  • Nitrogen-ready enclosure for dross reduction on lead-free alloys
  • Titanium finger claws with conveyor width auto-adjust

Specifications

PCB width50–450 mm
Solder pot capacityApprox. 450 kg (model dependent)
Preheat zones2–3 zones, PID controlled, up to 250 °C
Wave typeChip wave + laminar main wave, inverter controlled
Process controlPC + PLC, recipe storage and SPC logging
NitrogenOptional N₂ inerting package
Conveyor speed0–2,000 mm/min, programmable
Power3-phase AC 380 V, 22–30 kW

Applications

  • THT & mixed-technology PCBAs
  • LED drivers and ballasts
  • Power supplies
  • Automotive electronics
  • Industrial controllers

The S-WS450 runs a lead-free dual-wave process with independent chip wave and main wave control, PC recipe management and full preheat profiling. It is the machine that turns a THT insertion line into a finished-PCBA line, and it is the single most common first purchase for EMS factories moving off hand soldering.

See it run

Machine in action

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FAQ

Common questions

Lead-free or tin-lead — what does the machine support?
Both. The pot, pump and conveyor are specified for lead-free alloy temperatures (up to 300 °C pot temperature). Recipe switching between SAC305 and Sn63/Pb37 is a software selection, with a pot change recommended between alloys.
How do you control dross on lead-free?
Three levers: nitrogen inerting, a laminar main wave that reduces turbulence, and a correctly profiled preheat. We supply the recommended profile with the machine and tune it during commissioning.
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