Board Handling & Automation

S-320AT Inline Automatic Lead Cutter

Inline lead trimming straight after wave soldering, with height-controlled cut and vacuum extraction

  • Inline SMEMA connection directly after the wave soldering machine
  • Adjustable cut height with dial indicator repeatability
  • Vacuum swarf extraction to protect downstream test fixtures
  • Tooled carbide or high-speed steel cutters, quick change

Specifications

PCB width50–350 mm
Cut height0.8–3.0 mm adjustable
ThroughputUp to 1,800 boards/hour (board dependent)
CutterCarbide or HSS, quick-change cartridge
ExtractionIntegrated vacuum swarf collection
ConveyorESD belt, speed matched to line
InterfaceSMEMA
PowerAC 220 V, 0.4 MPa

Applications

  • Post-wave-soldering trimming
  • THT lines with mixed lead lengths
  • Power supply and charger production

After wave soldering, protruding leads must be trimmed to specification before test and assembly. The S-320AT cuts inline at line rate with adjustable cut height, collects swarf by vacuum and keeps the board flat — no separate off-line station, no extra handling.

See it run

Machine in action

PCB reverse conveyor PCB Assembly by Through hole technology

Board Handling 01:59
Downloads

Catalogs & datasheets

FAQ

Common questions

Will cutting damage the solder joints?
Not when the cut height and cutter condition are correct. The board is supported flat at the cut point and the cut is made above the fillet. We supply the recommended cut height for your lead diameter and solder fillet specification.
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